The Circuit

In this engaging discussion, Huiming Bu, who manages the global semiconductor R&D agenda at IBM Research, shares insights into the future of transistor design. He highlights the exciting shift from FinFET to nanosheet architectures and explores advanced techniques like vertical transport FET and stacked transistors. The conversation also addresses the need for new innovations in 3D chiplet design and the role of major foundries like TSMC and Intel. Finally, Huiming emphasizes the collaborative efforts required to tackle the challenges in meeting the growing demand for computational power.

Ben Bajarin and Jay Goldberg discuss the anticipated update to the entity list facing US and China semiconductor relations. They also discuss the relevance of the RISC-V being discussed as potentially being regulated as it relates to China as well.   

Ben Bajarin and Jay Goldberg welcome guest Steven Woo, a Fellow at Rambus, to discuss the wide world of memory.  The discussion covers how memory differs from logic, the many types of memory and their purpose and function, how to gauge innovation in memory advances, and the key applications driving the need to innovate more in memory.  

Ben Bajarin and Jay Goldberg discuss the state of Intel as interpreted by what they saw and learned from Intel's Innovation Summit - Called Innovation.  Topics:- Intel's products and product roadmap competitiveness - Read on What Public Investors took away- Intel's Foundry Opportunity and Timing 

In this episode, Ben Bajarin and Jay Goldberg discuss a myriad of subjects from recent news in the semi-industry. Main topics:Apple A17 ProArm IPOHuawei Kirin 9000China's Ambitions and the intent of sanctions

On this week's episode of The Circuit, Ben Bajarin and Jay Goldberg are joined by Stacey Higginbotham to discuss the land of IoT. They cover everything from market segments, use cases, the unified software dream, key companies in silicon, and more. 

Ben Bajarin and Jay Goldberg discuss Nvidia's recent earnings, and the growth prospects for the company going forward.  They discuss a number of key debates surrounding the company and if this is a bubble or a buildout technology cycle as it relates to AI and the demand on compute infrastructure. 

The lack of coverage surrounding the Arm F1 IPO and its relation to semiconductors is discussed. Concerns about revenue concentration in China are explored, along with the challenges of ranking customers. The ArmChina joint venture and potential risks are analyzed. The decline in revenue and the importance of financial diversity are highlighted. The growth prospects of ARM and their changing business model are discussed, including valuation, involvement in consumer electronics, and attracting new customers.

Ben Bajarin and Jay Goldberg discuss the Intel - Tower Semi deal falling through. They discuss the increasing challenge of global semiconductor M&A.  They also dig into foundry capacity challenges and the economic opportunity for TSMC competitors at the leading edge.  

Ben Bajarin and Jay Goldberg discuss some of the recent political narratives from different countries around their desire to lessen dependence on certain nations. They discuss how much of this narrative dismisses the deeply intertwined global supply chain that makes up the semiconductor industry.