Huiming Bu

In this engaging discussion, Huiming Bu, who manages the global semiconductor R&D agenda at IBM Research, shares insights into the future of transistor design. He highlights the exciting shift from FinFET to nanosheet architectures and explores advanced techniques like vertical transport FET and stacked transistors. The conversation also addresses the need for new innovations in 3D chiplet design and the role of major foundries like TSMC and Intel. Finally, Huiming emphasizes the collaborative efforts required to tackle the challenges in meeting the growing demand for computational power.