3170: The Next Semiconductor Revolution: Synopsys on Multi-Die Integration

Feb 4, 2025

In this engaging conversation, Abhijeet Chakraborty, VP of Engineering at Synopsys, dives into the future of semiconductors. He discusses the shift to multi-die integration as a solution to the limits of traditional chip design. With the demands of AI and high-performance computing on the rise, multi-die architectures are set to revolutionize the industry. Chakraborty highlights breakthroughs like Universal Chiplet Interconnect Express and how AI is optimizing chip reliability, ensuring efficient advancements in the semiconductor landscape.

Ask episode

AI Snips

Chapters

Transcript

Episode notes

INSIGHT

Multi-Die for AI and HPC

Multi-die architectures are essential for meeting the increasing demands of AI and high-performance computing.
This is because die sizes are exceeding manufacturable limits, requiring chips to be broken into smaller, interconnected dies.

INSIGHT

Multi-Die Market Growth

The multi-die chip market is projected to reach $411 billion by 2035, driven by pervasive intelligence and the rise of custom chips.
Government investments and the increasing demand for "smart everything" further fuel this growth.

INSIGHT

UCIe and Chiplet Integration

UCIe standardizes die-to-die connectivity, enabling a "chiplet economy" with plug-and-play components.
Synopsys collaborated with Intel and TSMC on the first UCIE test chip, offering both advanced and standard packaging options.

Get the Snipd Podcast app to discover more snips from this episode

Get the app

What happens when the limits of traditional chip design collide with the relentless demand for AI and high-performance computing? In today’s episode, I sit down with Abhijeet Chakraborty from Synopsys to explore how multi-die chip architectures are redefining the future of semiconductors. With Moore’s Law slowing and the complexity of computing workloads skyrocketing, the industry is turning to multi-die solutions to push the boundaries of performance, scalability, and efficiency.

Synopsys is at the heart of this transformation, powering more than 95% of the world’s advanced chip designs. As AI, IoT, and next-gen computing drive an insatiable need for faster, more efficient processors, the semiconductor industry is undergoing a radical shift. By 2035, the multi-die chip market is expected to reach $411 billion, with at least 50% of new HPC chip designs set to be multi-die or 3D by the end of 2025.

Abhijeet walks us through the breakthroughs in Universal Chiplet Interconnect Express (UCIe), the growing role of silicon lifecycle management, and how Synopsys is pioneering multi-die integration to help companies accelerate time-to-market while balancing power, performance, and cost. We also discuss how AI itself is being used to optimize semiconductor design, ensuring these complex chip architectures remain reliable and efficient.

With major industry players investing heavily in this technology, the semiconductor landscape is at a critical inflection point. But what are the biggest challenges in making multi-die architectures mainstream? How will innovations in packaging, interposers, and hybrid bonding influence adoption? And with AI models demanding unprecedented levels of compute power, can multi-die designs truly keep pace with the ever-expanding capabilities of artificial intelligence?

Join us for this deep dive into the future of semiconductors, the rise of chiplets, and why the next decade will be defined by radical shifts in computing architecture. As always, I’d love to hear your thoughts—where do you see the future of chip design heading, and what challenges do you think the industry must overcome?