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Abhijeet Chakraborty

Vice President of Engineering at Synopsys, responsible for developing EDA tools and solutions for multi-die chip architectures. He also serves on technical advisory boards in the semiconductor industry.

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Feb 4, 2025 • 23min

3170: The Next Semiconductor Revolution: Synopsys on Multi-Die Integration

In this engaging conversation, Abhijeet Chakraborty, VP of Engineering at Synopsys, dives into the future of semiconductors. He discusses the shift to multi-die integration as a solution to the limits of traditional chip design. With the demands of AI and high-performance computing on the rise, multi-die architectures are set to revolutionize the industry. Chakraborty highlights breakthroughs like Universal Chiplet Interconnect Express and how AI is optimizing chip reliability, ensuring efficient advancements in the semiconductor landscape.