Episode 32: A Conversation with Greg Smith and Tony Lentz About Stencil Design and Void Reduction
Greg and Tony talk to me about stencil design and how to reduce voiding. Voiding is a key concern in specific electronic applications including automotive and LED electronic manufacturing. Greg and Tony published a paper entitled "Root Cause Stencil Design for SMT Component Thermal Lands"
Download here:
https://tinyurl.com/szx3xt8Greg Smith can be reached here:
gsmith@blueringstencils.comTony Lentz can be reached here:
tlentz@fctassembly.com
Reliability Matters