Higher voltages and higher frequencies are becoming commonplace in embedded designs. That in itself doesn’t necessarily cause an issue. But when you add in that packages continue to shrink in size, you have the potential for detrimental heat and airflow issues. How do you deal with that? That’s where the discussion started with Dr. Phil Lessner, the Senior Vice President and Chief Technology Officer, at KEMET. He had lots of advice for system designers in this week’s Embedded Executives podcast.
