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Huawei and the US-China Chip War — #44

Manifold

CHAPTER

Challenges in Chinese 7nm Chip Manufacturing

This chapter explores the challenges faced by Chinese companies in manufacturing 7nm chips, discussing the restrictions on acquiring EUV lithography machines and the use of DUV lithography and multi-patterning techniques. It also discusses the impact of these challenges on the cost and yield of chips made in China.

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