Embedded Executive Podcast

Sean Park, the President, CEO, and Founder of Point2 Technology, discusses the urgent need for efficient interconnect solutions in rapidly expanding AI data centers. He highlights the transition from traditional copper to advanced optical systems to meet soaring power demands. Sean explains the distinctions between active and passive interconnects, introducing the innovative E-tube solution for simplified energy-efficient transmission. The conversation also delves into strategic partnerships and the economic advantages of these technologies, paving the way for a greener future in computing.

For as long as we’ve been designing embedded computers and consumer electronics, we’ve had a problem figuring out how to handle the heat that’s created. Known as thermal management, the problem seems omnipresent as systems become more compact, processors run faster, and so on. Unfortunately, many designers don’t think about thermal management until it’s too late in the design process, which further exacerbates the problem. So what’s a developer to do? That’s what I asked Carl Schlachte, the President and CEO of Ventiva, who specializes in this technology, in this week’s Embedded Executives podcast.

While it may not be as intimidating as it once was, antenna design can still be a make-or-break aspect of your end product. Make the antenna too big, and the end users balk. Make the antenna too small, and the device won’t function properly (and end users will balk). To understand where and how the antenna design should begin, I spoke with Dermot O'Shea, the CEO of Taoglas, an expert in antenna design and certification, on this week’s Embedded Executives podcast.

TSMC recently announced its exit from the GaN space. Well, maybe “announced” is the wrong word, but they did let customers know that they will not be producing GaN devices going forward. Details are still coming out, so we don’t know exactly when that stoppage will occur. So what does that mean for TSMC partners who relied on them to produce their products? To understand what that means, I spoke to Johannes Schoiswohl, the Senior Vice President and General Manager of Infineon’s GaN Business Line. Infineon may have an easier time than others making this transition, but it’s an interesting time nonetheless. Check out this week’s Embedded Executives podcast to learn more.

Compute in the automobile is (again) moving toward consolidation and away from the discrete nature of multiple processors around the vehicle. Is this a trend that’s going to stick? I guess it depends on who you ask. In this case, I asked Robert Moran, the GM & VP for Automotive Processors at NXP Semiconductors. As we add AI and autonomous drive to the software-defined vehicle (SDV), a move like this is pretty much a requirement. Hear it right from the horse’s mouth on this week’s Embedded Executives podcast.

The Cyber Resilience Act (CRA) is a regulation designed to enhance cybersecurity for products mainly sold in Europe. It establishes common cybersecurity standards for hardware and software, requiring manufacturers to build security into their products from design through the products’ complete lifecycle. It’s this latter concept that can be troubling, as sometimes devices stay in use for a long, long time. So what’s a manufacturer to do? That’s the concept that was on the table for this week’s Embedded Executives podcast with Eystein Stenberg, founder and CTO of Northern.tech.

While most autonomous vehicle focus is on the automobile, Mozee is going in a slightly different direction, no pun intended. Mozee is focused on autonomous buses, or vehicles that transport large numbers of people. As you might expect, such a system has its challenges, in addition to those typically associated with an automobile. What makes the company’s solution different is that it operates in real-time, without the need for “pre-mapping” the city in which the vehicle travels. It does this through its AI engine. Hear more directly from Shawn Taikratoke, Mozee’s CEO, on this week’s Embedded Executives podcast.

Two technologies seem to be barreling ahead at a rapid pace, and there is likely a convergence coming shortly, if it hasn’t already occurred. I’m referring to space travel and artificial intelligence. But in my limited knowledge, there appears to be a disconnect in this marriage, whereby how could AI make decisions on something it’s never encountered before? To boost my limited knowledge, I invited Sakya Dasgupta, the Founder and CEO, EdgeCortix, to be my guest on this week’s Embedded Executives podcast. He has experience in this space (pun intended) and we discussed what’s happening today and what we can expect in the near future.

Designing wearables with integrated AI /ML just got one step easier with Nordic Semiconductor’s acquisition of Neuton.AI. While the two companies had already been working together, you can expect a lot more integration between Nordic’s MCUs and the very low-power AI IP that Neuton.AI has become famous for. On this week’s Embedded Executives podcast. I spoke to Øyvind Strom, the EVP of Nordic’s Short-Range Business Unit. He explains why a developer should sit up and take notice, and what the design community can expect from this powerful combination down the road.

The line between a maker and a maker pro is quite fuzzy. In my opinion, the maker wants to build one of something, and likely won’t want to build more than one. The maker pro starts out building one, but knows somewhere down the line that the project could turn into a far larger volume. If you fall into that latter group, does that change some of your design decisions, even where you begin? Do you start with a Pi, or do you use something that’s more “professional?” This is the conversation I had with Okan Saracoglu, the Vice President of Growth at Sixfab. Hear what he had to say on the subject forward, on this week’s Embedded Executives podcast.