PCB Chat

Kent Balius has been at the forefront of front-end engineering for 30 years at some of the world's largest PCB fabricators. He spent the past 20 years at TTM / Viasystems, where he managed software applications and automation solutions for North America and Asia-Pacific operations. He just launched EPIC Front-End Engineering, which provides consultation, project management, software applications and development support to the PCB manufacturers, with the objectives of driving advanced automation to achieve productivity, improved quality, reduced labor costs. He speaks about how the automation of design-to-fabrication the affects Industry 4.0 implementation with PCB Chat's Mike Buetow.

Conductive anodic filament (CAF) is a form of electrochemical migration (ECM). Unlike surface-level ECM, CAF exists beneath the surface of the circuit assembly. Graham and Mike Konrad discuss the causes of CAF and methods to test for and mitigate CAF. Graham has an extensive history working in the electrical and electronic manufacturing industry. Graham was the IEC 1906 Lord Kelvin Award Winner. IEC TC91 WG2, 3 and 10 Maintenance Leader of 4 Standards. He is vice chair of the IPC 5-30 Cleaning and Coating Sub-Committee overseeing 15 IPC Standards Development Committees. He has received 14 IPC Standards Awards and is a BSI British Standards Institution (EPL501) Member. Graham is a Specialist in Insulation Resistance Testing, Ionic Contamination Control, Solderability, Conformal Coating materials and application systems, including Cleaning, Inspection and Test.  

EMA Design Automation has recently added the Mentor ECAD sales staff from Trilogic EDA. Manny Marcano, president and founder of EMA, explains what this means for the PCB CAD marketplace, and how the mainstream CAD market is shaping up.  

Voiding is the cause of multiple failure mechanisms. Mike Konrad speaks with solder material expert Tim O'Neill of Aim Solder, stencil manufacturer Prakash Gango of StenTech, and cleaning materials manufacturer Kalyan Nukala of Zestron about how solder voiding leads to product failures and methods to reduce voiding.   The guests may be reached here: Tim O'Neill AIM Solder toneill@aimsolder.com www.aimsolder.com   Prakash Gango StenTech prakash@stentech.com www.stentech.com   Kalyan Nukala Kalyan.Nukala@zestronusa.com www.zestron.com

Dr. Martin Anselm is a professor at Rochester Institute of Technology (RIT) and is also the newly elected president of the Surface Mount Technology Association or SMTA. Martin also worked for Universal Instruments. During his 12-year career at Universal Instruments, Martin was, among other positions, a process research engineer and manager of Failure Analysis Services. Martin completed his Ph.D. in materials science and engineering through Binghamton University. His research topic involved copper-nickel-tin intermetallic formation kinetics on electroless nickel substrates. Martin also has a master's in mechanical engineering from Clarkson and a bachelor's in physics from SUNY Geneseo.  

IPC-2581 is a standard format for describing and transferring printed circuit board design and assembly manufacturing data from the OEM to fab and assembly. It is an open format developed by industry consensus through the auspices of IPC, and it is vendor-neutral. IPC-2581 is being rebranded as IPC-DPMX, which stands for Digital Product Model Exchange. On this episode of PCB Chat, host Mike Buetow is joined by IPC-2581 Consortium chair Hemant Shah, DfM expert Dana Korf, Cisco technical leader of electrical engineering Terry Hoffman, and IPC manager of design standards Patrick Crawford. They discuss the latest revision to IPC-2581, which is set to be released in November.

Brad Griffin, product management group director at Cadence, returns to PCB Chat to discuss Clarity 3D Transient Solver, a new system-level simulation solution that solves EMI system design issues up to 10 times faster than legacy 3-D field solvers, and handles workloads that previously required anechoic test chambers to ensure EMC compliance.   

Michael Ford and Mike Konrad talk about Digital Twin, its purpose, value, and its future. Michael Ford, senior director of emerging industry strategy at Aegis Software, has more than 30 years working within the electronics assembly manufacturing space. With a degree in electronics from the University of Wales, he started his career with Sony in the UK, creating software solutions as he acquired a broad range of manufacturing knowledge. He spent eight years working in Japan, which provided Ford the opportunity to expand his innovation and leadership on a global enterprise scale. Today, Ford is senior director of emerging industry strategy for Aegis Software. Having worked with specialized software solution providers in the industry, he is an established thought leader for Industry 4.0 and smart factories. He is also actively working on industry standards with the IPC, including his position as chair of new traceability standard, IPC-1782. Earlier this year, Ford's thought leadership on Industry 4.0 manufacturing and development of the IPC Connected Factory Exchange (CFX) was formally recognized when IPC awarded him with its President’s Award.

In this episode, Mike Konrad speaks with Mike Buetow, Editor in Chief of PCD&F/CIRCUITS ASSEMBLY, Trevor Galbraith, publisher of Global SMT and Packaging, and Philip Stoten of Scoop TV. We discuss the state of the electronics assembly industry, the effects of COVID-19 on our industry, emerging technologies, and more.

We hear a lot about the graying of the PCB industry. Charles Hutchins Award Andrew Daya  has been working in the industry fulltime for about six years and has bachelor’s and master’s degrees in engineering from Rochester Institute of Technology. He talks about his jobs to date, which include Garmin, Anaren and Bose, how design and manufacturing can and do (or don't) work together, and what winning the Hutchins Award and getting involved in SMTA has meant for his career.