Welcome to another episode of our payments series. This time we’re diving into B2B payments with Brandon Lloyd of Forward, Bo Jiang of Lithic and Wade Arnold of Moov.

These 3 are experts to say the least. We covered everything from the transformation of payments infrastructure, complexity of embedded payments, the regulatory environment, adoption (or lack of) of pay by bank and FedNow, and future innovation predictions.

Huge thanks to our sponsors, Highnote and Array, for making this series possible!

While most issuer processors build small, predefined boxes for their customers to fit in, Highnote has built a game-changing platform that enables unparalleled flexibility for its customers to differentiate their card offerings. On top of that, they can do it across all commercial, consumer, credit, and debit program types.

Visit Highnote.com to learn more about how to take your card program to the next level.

Array offers embeddable tools that integrate seamlessly into your fintech platform, from identity and privacy protection to credit monitoring. Array helps fintechs fast-track their innovation, generate revenue, and enhance user experience. With Array, you’re not just keeping up – you’re leading. Visit www.array.com/TWIF to learn more.