
The Peter Zeihan Podcast Series The Semiconductor Frontier || Peter Zeihan
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Nov 13, 2025 Explore the cutting-edge world of semiconductors as advancements in ASML’s High-NA EUV lithography machines are unveiled. Discover the significance of these massive machines that enable ultra-fine etching at the nanometer scale. Examine Intel's race to regain its position with new High-NA trials and the potential transformative leap for chip architecture. Delve into the complexities of semiconductor supply chains and geopolitical implications. Will Intel rise to lead, or remain second-best? The future takes shape!
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High-Precision Lithography Breakthrough
- ASML's EUV machines are bus-sized tools that etch silicon with lasers at sub-DNA accuracy enabling nanometer-level transistors.
- Current EUV reaches ~3 nm while High-NA EUV aims for ~1 nm, potentially enabling much denser chips.
TSMC's Early Advantage
- EUV entered the industry around 2012–2014 and TSMC embraced it to leapfrog Intel in manufacturing capability.
- Intel is now testing High-NA machines to try to repeat TSMC's comeback using the new technology.
Early Testing, Long Road To Scale
- Intel currently has two High-NA machines in Hillsboro running small-scale tests targeting ~10,000 chips/month as a prototype phase.
- Mass manufacturing and industrial build-out are needed before impact, so widespread use won't arrive until years later.
