Challenges and Future of Lithography Technology

The transition of semiconductor production from Taiwan to the U.S. poses several challenges, particularly concerning labor and technology. Although the skilled labor required for chip manufacturing is costly in the U.S., advancements in automation through extreme ultraviolet lithography (EUV) reduce the dependency on manual adjustments, leading to better efficiency and lower wastage. However, the high-end breakthroughs for future chips may not originate from TSMC’s facilities, as Intel's collaboration with ASML on high numerical aperture technology sets it apart. As TSMC continues to progress with its 4 nanometer chips, updates on the timeline for more advanced facilities remain uncertain, with potential operations slated for 2026.