Bloomberg Talks ASML CEO Christophe Fouquet Talks AI Demand, Chips
6 snips
Dec 12, 2025 Christophe Fouquet, the CEO of ASML, a leader in semiconductor manufacturing, dives into the future of chip technology. He reveals the company’s plans to transition to high numerical aperture EUV, targeting chip geometries below 2nm. Fouquet discusses the rising demand for advanced 3D packaging driven by AI needs and highlights ASML's investment in the AI startup Mistral to enhance R&D efficiency. He also shares insights on the shift from market hype to AI's industrial value and the crucial role hyperscalers play in shaping future equipment demands.
AI Snips
Chapters
Transcript
Episode notes
Lithography's Long Road Of Improvement
- Lithography will keep improving on resolution, accuracy, and productivity for many years.
- ASML expects to lead innovations including transitioning from low NA to high and even hyper NA tools by the mid-2020s to 2030s.
3D Packaging As A Density Multiplier
- 3D or advanced packaging complements lithography when planar transistor density isn't enough.
- ASML sees vertical stacking as essential to meet the exponential transistor needs of AI workloads.
Apply AI To Internal Engineering Work
- Use AI to speed internal development and maintenance by automating documentation and procedures.
- Apply AI to analyze machine data to improve product performance and free engineers for higher-value work.