Technological Barriers and Semiconductor Manufacturing

The discussion details the technological distinction between deep ultraviolet (DUV) and extreme ultraviolet (EUV) lithography methods in semiconductor manufacturing, emphasizing the importance of these technologies in producing high-quality chips. EUV allows for more precise etching at the atomic level, thereby achieving greater efficiency and improved performance in chip production with fewer errors compared to DUV, which is less advanced and more reliant on manual engineering processes. Despite recent advancements, Chinese manufacturers struggle to replicate EUV technology due to their inability to produce the necessary machines, which are exclusively made by the Dutch company ASML. As a result, China’s access to high-performance semiconductor technology faces significant hurdles, limiting its potential for innovation in competitive fields like artificial intelligence and electric vehicles.