RM 56: A Conversation about Solder Voiding with Solder Materials, Stencil, and Cleaning Experts
Dec 2, 2020
50:09
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Voiding is the cause of multiple failure mechanisms. Mike Konrad speaks with solder material expert Tim O'Neill of Aim Solder, stencil manufacturer Prakash Gango of StenTech, and cleaning materials manufacturer Kalyan Nukala of Zestron about how solder voiding leads to product failures and methods to reduce voiding.
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