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Episode 105 - Apple's Growing Pains

Advent of Computing

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The Apple 3's Heat-Warping Problem

A Stack Exchange user claims to be Ronald Nicholson, another early-ampl employee. He apparently witnessed the slamming event and recommended the solution to him. Apple logic's take is that heat cycling alone shouldn't be enough to pop chips. The only issue I see with this theory would come down to chip packing.

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