Signal Integrity Mastery: Scott McMorrow's PCB Design Revolution
OnTrack: The PCB Design Podcast
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Challenges of VIA Designs in RF and High-Speed Applications
This chapter discusses the difficulties in achieving the right parameters for VIA designs in RF and high-speed applications. It covers topics such as manual tuning, physics-based approach for simplifying variations, considerations for dielectric materials, and the importance of collaboration with the layout team and fabricator for manufacturability.
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