
Episode 152: High-Reliability Solder Paste Selection Best Practices
Reliability Matters
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Evolution of Solder Paste: From Leaded to Lead-Free
This chapter explores the significant evolution of solder paste, highlighting the transition from leaded to lead-free materials driven by the automotive industry's demand for reliability. It discusses the technical aspects of solder paste selection, including electrochemical and thermomechanical reliability, and the challenges faced in modern electronics. Additionally, the chapter examines the influence of component size and solder type classifications, emphasizing the importance of tailored solutions for the ever-evolving electronics landscape.
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