This chapter discusses chip packaging, the trend of increasing integration, and the implications for Apple chips. It explores the concept of producing chiplets in optimized process nodes and the integration of components from different manufacturers. It also delves into the cross-pollination of key technologies in chip development and the implementation of memory error correction features in Apple's M series chips.
- Pre-show: Moving is not fun.
- Follow-up:
- Apple fixes worn keycaps (via Ezekiel Elin)
- OpenAI
- Tip for buying smart thermostats (via Neil Weinstock)
- Marco’s many-taps Ecobee
- Chip packaging
- Introductory videos on packaging
- ECC RAM in Apple Silicon (via Grady Borders & Joe Lion)
- Green bubbles get slightly less 🤢?
- Apple extends free 🛰️ emergency services
- Thunderbolt 5
#askatp
:
- Can John take us on a tour of his recommended TVs? (via Gary Owen)
- Have we ever had iCloud randomly revert a file? (via Stephen Towler)
- Which apps should be blocked from refreshing in the background? (via Marcos Vinícius Petri)
- Post-show: Moving is fun.
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