563: Drain the Attic
Accidental Tech Podcast
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Chip Packaging, Integration, and Implications for Apple
This chapter discusses chip packaging, the trend of increasing integration, and the implications for Apple chips. It explores the concept of producing chiplets in optimized process nodes and the integration of components from different manufacturers. It also delves into the cross-pollination of key technologies in chip development and the implementation of memory error correction features in Apple's M series chips.
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