Bloomberg Tech cover image

Record High Car Prices and C3 AI's New Air Force Partnership

Bloomberg Tech

00:00

Designing Into the Future With GM

The chips and science bill solved one half of the equation, which was putting capacity on shore. The other half is making sure there's demand to use that capacity. There is an appetite in the will and the desire to bring more of semiconductor manufacturing to GF's global footprint including the US.

Play episode from 28:25
Transcript

The AI-powered Podcast Player

Save insights by tapping your headphones, chat with episodes, discover the best highlights - and more!
App store bannerPlay store banner
Get the app