Asianometry cover image

Let’s Break Down the 45nm Process Node

Asianometry

00:00

From LOCOS to Shallow Trench Isolation

Asianometry outlines LOCOS limitations, STI process steps: oxide/nitride layers, lithography, RIE trenches, TEOS fill and CMP.

Play episode from 08:19
Transcript

The AI-powered Podcast Player

Save insights by tapping your headphones, chat with episodes, discover the best highlights - and more!
App store bannerPlay store banner
Get the app