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Chip-Gigant Intel unter Druck durch Konkurrenzkampf & Pactos 2,7 Mio. Pre-Seed – Philippe Klitzing (Peak)

Startup Insider

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Welche praktischen Hürden erwarten Verhandlungen?

Philippe nennt Governance-, CapEx‑ und IP‑Fragen, die Joint Ventures zwischen Intel, TSMC und Apple erschweren.

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