Asianometry cover image

The AI Bandwidth Wall & Co-Packaged Optics

Asianometry

00:00

Navigating the Bottleneck: Co-Packaged Optics and the Future of Semiconductor Performance

This chapter explores the advancements and challenges in the semiconductor industry, with a focus on co-packaged optics and the scaling issues between compute power and optical I/O bandwidth. It discusses the implications of these challenges on data transfer efficiency in server racks and the impact of AI applications on the industry's vision.

Transcript
Play full episode

The AI-powered Podcast Player

Save insights by tapping your headphones, chat with episodes, discover the best highlights - and more!
App store bannerPlay store banner
Get the app