One of the most critical aspects of manufacturing high-reliability circuit assemblies is thermal profiling during the reflow process.
Whether you're designing, engineering, or troubleshooting circuit assemblies, understanding how temperatures during the reflow process influences the quality and performance of your assemblies is essential.
In this episode, we’ll break down what thermal profiling is, why it’s important, and how it affects everything from solder joint integrity to component placement.
We’ll also explore the challenges and solutions involved in getting your thermal profile just right, ensuring your circuit assemblies are built to last in a competitive and demanding industry.
Will review thermal profiling best practices, common mistakes, and the various capabilities of thermal profilers.
I guest today is Mark Waterman. Mark is the Electronics division manager at ECD, a manufacturer of thermal profiling equipment founded in 1964. Mark began his career at ECD in 2006.
I’ll ask Mark all about thermal profiling best practices right after this.
Mark Waterman's Contact Information:
Mark Waterman
mark.waterman@ecd.com
https://ecd.com
