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#672 – Silicon Revolution with Matt Venn

The Amp Hour Electronics Podcast

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Navigating Chip Design: Multi-Project Wafer Solutions and Tiny Tape Out Innovations

This chapter explores the intricacies and financial aspects of chip design and manufacturing, focusing on techniques like multi-project wafers to reduce costs. It highlights the role of larger firms and introduces eFabless and the Tiny Tape Out initiative as methods to increase accessibility and affordability in chip production.

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