
#672 – Silicon Revolution with Matt Venn
The Amp Hour Electronics Podcast
Navigating Chip Design: Multi-Project Wafer Solutions and Tiny Tape Out Innovations
This chapter explores the intricacies and financial aspects of chip design and manufacturing, focusing on techniques like multi-project wafers to reduce costs. It highlights the role of larger firms and introduces eFabless and the Tiny Tape Out initiative as methods to increase accessibility and affordability in chip production.
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