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Better Thermal and Power Efficiency for Your PCB

OnTrack: The PCB Design Podcast

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The Future of Power Products From TI

Stephen Schnier: QFN is going to be easier for routing in on maybe a lower layer count board. We're always going with higher power density, so expect more progress on that. Lately, we're doing more pin compatible type devices. And you'll be able to see some of the products that we've talked about in this podcast episode.

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