Wafer on Wafer Bonding - Applied Materials

Wafer on wafer bonding is a new way to make chips ultra thin. Applied materials are in every step of the bonding process, but they're not actually in the bonding process. Power viasa supposedly in the 20 eigh process for intel. We've heard rumors of the buried powered rail,. One way to do this backside power or, i guess, a permutation of a new power delivery method.