3min chapter

Last Week in AI cover image

#144 - OpenAI CEO UN-FIRED, Cruise founders quit, Meta video editing, LLMs can lie, policy updates

Last Week in AI

CHAPTER

US Commerce Department Launches $3 Billion Effort to Boost Chip Packaging Industry

This chapter discusses the US Commerce Department's launch of a $3 billion effort to stimulate semiconductor production in the US by boosting the domestic chip packaging industry. The speakers explore the significance of TSMC as a provider and the potential implications of China's actions on chip-making technology, highlighting the importance of this issue in the context of China-Taiwan tensions.

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