This chapter discusses interviews with industry experts highlighting the importance of chip packaging for future advancements in technology. It explores Apple's potential direction in packaging innovation and Intel's strategy of investing in advanced packaging. The chapter also dives into the advantages of chiplets, including defect density reduction, higher performance, and reusable designs.
- Pre-show:
- Follow-up:
- OpenAI
#askatp
:
- What ever happened to ECC RAM, now that Apple Silicon is here? (via Tim Schmitz)
- How do we photograph kid art (via Chris Gleim)
- Does tech actually improve our lives? (via Jamie West)
- Post-show: Humane ai pin
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