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Designing with Modularity in Mind
This chapter explores the intricacies of designing System-in-Package (SIP) solutions, focusing on cost, volume, and the importance of modularity. The discussion highlights the integration of various components within a chip scale package and emphasizes the benefits of using modular designs for enhanced repairability and flexibility in electronics. Additionally, the chapter underscores the role of community engagement and open-source principles in fostering innovation and collaboration in the design process.