553: Cut the Bridges to the Mainland
Accidental Tech Podcast
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Manufacturers' Approach to Chip Defects
This chapter explores how manufacturers handle defects in silicon chips, including the partitioning of defective sections and the discarding of entire chips if essential parts are damaged. Different types of binning, such as disabling cores and frequency binning, are also discussed, with Apple noted as a company that typically doesn't engage in frequency binning.
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