This chapter explores how manufacturers handle defects in silicon chips, including the partitioning of defective sections and the discarding of entire chips if essential parts are damaged. Different types of binning, such as disabling cores and frequency binning, are also discussed, with Apple noted as a company that typically doesn't engage in frequency binning.
- Pre-show: John’s enhancement requests
- 🤬 cancer. Help sick kids. Donate to St. Jude now.
- ATP Top Four: Laptops. Join to listen!
- Follow-up:
- Gruber’s post
- Geekbench 6
- Does Apple make the fastest laptops?
#askatp
:
- How does mp3 chapter images work? (via Joel Labes)
- The “animated” chapter art was the ending theme song in ATP 244
- How does binning work with silicon chips? (via Ammar)
- Is USB-C’s successor on the horizon? (via Jason Falleiro)
- Post-show: Rivian follow-up and some interesting hacks
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