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Infineon-Managerin Sabine Herlitschka: KI-Blase, Chip-Krieg, Trump, Star Trek

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300‑Millimeter‑Wafer und Fertigungsvorsprung

Herlitschka erklärt Villachs 300‑mm‑Technologie, vertikale Stromführung und Effizienzvorteile von dünnen Scheiben.

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