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Intel's Foundry Strategy and Technological Advancements
This chapter delves into Intel's ambitious goals in enhancing manufacturing competitiveness, saving $10 billion by 2025, and building new fabs, like the one in Ohio. It compares Intel's approach with TSMC's, highlighting Intel's shifts towards embracing cutting-edge technologies like EUV, backside power, and nanoshoots, aiming to catch up and potentially surpass competitors in semiconductor technology. The chapter outlines Intel's strategy in closing the gap with innovative designs such as ribbon fit transistors and power via mechanisms, focusing on delivering quality process technology for a competitive edge.